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SX Family FPGAs RadTolerant and HiRel
Features
RadTolerant SX Family
* * * * * * Tested Total Ionizing Dose (TID) Survivability Level Radiation Performance to 100 Krads (Si) (ICC Standby Parametric) Devices Available from Tested Pedigreed Lots Up to 160 MHz On-Chip Performance Offered as Class B and E-Flow (Actel Space Level Flow) QMl Certified Devices
High Density Devices
* * * 16,000 and 32,000 Available Logic Gates Up to 225 User I/Os Up to 1,080 Dedicated Flip-Flops
Easy Logic Integration
* * * * * * * * * * Nonvolatile, User Programmable Highly Predictable Performance with 100% Automatic Place-and-Route 100% Resource Utilization with 100% Pin Locking Mixed Voltage Support - 3.3 V Operation with 5.0 V Input Tolerance for Low-Power Operation JTAG Boundary Scan Testing in Compliance with IEEE Standard 1149.1 Secure Programming Technology Prevents Reverse Engineering and Design Theft Permanently Programmed for Operation on PowerUp Unique In-System Diagnostic and Debug Facility with Silicon Explorer Software Design Support with Actel Designer and Libero(R) Integrated Design Environment (IDE) Tools Predictable, Reliable, and Permanent Antifuse Technology Performance
HiRel SX Family
* * * * * * * Fastest HiRel FPGA Family Available Up to 240 MHz On-Chip Performance Low Cost Prototyping Vehicle for RadTolerant Devices Offered as Commercial or Military Temperature Tested and Class B Cost Effective QML MIL-Temp Plastic Packaging Options Standard Hermetic Packaging Offerings QML Certified Devices
Product Profile
Device Capacity System Gates Logic Gates Logic Modules Register Cells Combinatorial Cells User I/Os (Maximum) JTAG Packages (by pin count) CQFP RT54SX16 (Obsolete) 24,000 16,000 1,452 528 924 179 Yes 208, 256 A54SX16 24,000 16,000 1,452 528 924 180 Yes 208, 256 RT54SX32 (Obsolete) 48,000 32,000 2,880 1,080 1,800 227 Yes 208, 256 A54SX32 48,000 32,000 2,880 1,080 1,800 228 Yes 208, 256
March 2005 (c) 2005 Actel Corporation
i See Actel's website for the latest version of the datasheet.
SX Family FPGAs RadTolerant and HiRel
Ordering Information
RT54SX32 1 CQ 256 B Application (Temperature Range) Blank = Commercial (0 to +70C) M = Military (-55 to +125C) B = MIL-STD-883 E = E-Flow (Actel Space Level Flow) Package Lead Count Package Type CQ = Ceramic Quad Flat Pack Speed Grade Blank = Standard Speed -1 = Approximately 15% Faster than Standard Part Number A54SX16 = 16,000 System Gates A54SX32 = 32,000 System Gates RT54SX16 = 16,000 System Gates - RadTolerant (Obsolete) RT54SX32 = 32,000 System Gates - RadTolerant (Obsolete)
Product Plan
Speed Grade Std -1* RT54SX16 Devices 208-Pin Ceramic Quad Flat Pack (CQFP) 256-Pin Ceramic Quad Flat Pack (CQFP) A54SX16 Devices 208-Pin Ceramic Quad Flat Pack (CQFP) 256-Pin Ceramic Quad Flat Pack (CQFP) RT54SX32 Devices 208-Pin Ceramic Quad Flat Pack (CQFP) 256-Pin Ceramic Quad Flat Pack (CQFP) A54SX32 Devices 208-Pin Ceramic Quad Flat Pack (CQFP) 256-Pin Ceramic Quad Flat Pack (CQFP) Applications: C = Commercial M = Military B = MIL-STD-883 E = E-flow (Actel Space Level Flow) Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete C Obsolete Obsolete Obsolete Obsolete Application M B Obsolete Obsolete Obsolete Obsolete *Speed Grade: Obsolete Obsolete Obsolete Obsolete E Obsolete Obsolete - - Obsolete Obsolete - -
Availability: = Available P = Planned - = Not Planned
-1= Approx. 15% faster than Standard
Ceramic Device Resources
User I/Os Device RT54SX16 A54SX16 RT54SX32 A54SX32 Note: Contact your Actel sales representative for product availability. CQFP 208-Pin 174 175 173 174 CQFP 256-Pin 179 180 227 228
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Table of Contents
SX Family FPGAs RadTolerant and HiRel
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 SX Family Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Other Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8 Development Tool Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10 RTSX Probe Circuit Control Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11 Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11 3.3 V / 5 V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13 Power-Up Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13 Power-Down Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13 Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15 Temperature and Voltage Derating Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17 SX Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19 A54SX16 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20 RT54SX16 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22 A54SX32 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-24 RT54SX32 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28
Package Pin Assignments
208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
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SX Family FPGAs RadTolerant and HiRel
SX Family FPGAs RadTolerant and HiRel
General Description
The Actel RadTolerant (RT) and HiRel versions of the SX Family of FPGAs offer many advantages for applications such as commercial and military satellites, deep space probes, and all types of military and high reliability equipment. The RT and HiRel versions are fully pin-compatible, allowing designs to migrate across different applications that may or may not have radiation requirements. Also, the HiRel devices can be used as a low cost prototyping tool for RT designs. The programmable architecture of these devices offers high performance, design flexibility, and fast and inexpensive prototyping--all without the expense of test vectors, NRE charges, long lead times, and schedule and cost penalties for design modifications required by ASIC devices.
Radiation Survivability
Total dose results are summarized in two ways. First, by the maximum total dose level that is reached when the parts fail to meet a device specification but remain functional. For Actel FPGAs, the parameter that exceeds the specification first is ICC, the standby supply current. Second, by the maximum total dose that is reached prior to the functional failure of the device. The RTSX devices have varying total dose radiation survivability. The ability of these devices to survive radiation effects is both device- and lot-dependent. The customer must evaluate and determine the applicability of these devices to their specific design and environmental requirements. Actel will provide total dose radiation testing data along with the test data on each pedigreed lot available for sale. These reports are available on the Actel website, or you can contact your local sales representative to receive a copy. A listing of available lots and devices will also be provided. These results are only provided for reference and for customer information. For a radiation performance summary, see Radiation Performance of Actel Products. This summary will also show single event upset (SEU) and single event latch-up (SEL) testing that has been performed on Actel FPGAs.
Device Description
The RT54SX16 and A54SX16 devices have 16,000 available gates and up to 179 I/Os. The RT54SX32 and A54SX32 have 32,000 available gates and up to 228 I/Os. All of these devices support JTAG boundary scan testability. All of these devices are available in Ceramic Quad Flat Pack (CQFP) packaging, with 208-pin and 256-pin versions. The 256-pin version offers the user the highest I/O capability, while the 208-pin version offers pin compatibility with the commercial Plastic Quad Flat Pack (PQFP-208). This compatibility allows the user to prototype using the very low cost plastic package and then switch to the ceramic package for production. For more information on plastic packages, refer to the 54SX Family FPGAs datasheet. The A54SX16 and A54SX32 devices are manufactured using a 0.35 technology at the Chartered Semiconductor facility in Singapore. These devices offer the highest speed performance available in FPGAs today. The RT54SX16 and RT54SX32 devices are manufactured using a 0.6 technology at the Matsushita (MEC) facility in Japan. These devices offer levels of radiation survivability far in excess of typical CMOS devices.
QML Certification
Actel has achieved full QML certification, demonstrating that quality management, procedures, processes, and controls are in place and comply with MIL-PRF-38535, the performance specification used by the Department of Defense for monolithic integrated circuits. QML certification is a good example of Actel's commitment to supplying the highest quality products for all types of high-reliability, military, and space applications. Many suppliers of microelectronics components have implemented QML as their primary worldwide business system. Appropriate use of this system not only helps in the implementation of advanced technologies, but also allows for quality, reliable, and cost-effective logistics support throughout the life cycles of QML products.
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Disclaimer
All radiation performance information is provided for information purposes only and is not guaranteed. The total dose effects are lot-dependent, and Actel does not guarantee that future devices will continue to exhibit similar radiation characteristics. In addition, actual performance can vary widely due to a variety of factors, including but not limited to, characteristics of the orbit, radiation environment, proximity to satellite exterior, amount of inherent shielding from other sources within the satellite, and actual bare die variations. For these reasons, Actel does not guarantee any level of radiation survivability, and it is solely the responsibility of the customer to determine whether the device will meet the requirements of the specific design.
Programmable Interconnect Element
Actel's SX family provides much more efficient use of silicon by locating the routing interconnect resources between the Metal 2 (M2) and Metal 3 (M3) layers (Figure 1-1). This completely eliminates the channels of routing and interconnect resources between logic modules (as implemented on SRAM FPGAs and previous generations of antifuse FPGAs), and enables the entire floor of the device to be spanned with an uninterrupted grid of logic modules. Interconnection between these logic modules is achieved using Actel's patented metal-to-metal programmable antifuse interconnect elements, which are embedded between the M2 and M3 layers. The antifuses are normally open circuit and, when programmed, form a permanent low-impedance connection. The extremely small size of these interconnect elements gives the SX family abundant routing resources and provides excellent protection against design pirating. Reverse engineering is virtually impossible, because it is extremely difficult to distinguish between programmed and unprogrammed antifuses, and there is no configuration bitstream to intercept. Additionally, the interconnects (i.e., the antifuses and metal tracks) have lower capacitance and lower resistance than any other device of similar capacity, leading to the fastest signal propagation in the industry.
SX Family Architecture
The SX family architecture was designed to satisfy nextgeneration performance and integration requirements for production-volume designs in a broad range of applications.
Routing Tracks
Metal 3 Amorphous Silicon/ Dielectric Antifuse Tungsten Plug Via Metal 2
Metal 1 Tungsten Plug Contact
Silicon Substrate
Figure 1-1 * SX Family Interconnect Elements
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Logic Module Design
The SX family architecture has been called a "sea-ofmodules" architecture because the entire floor of the device is covered with a grid of logic modules with virtually no chip area lost to interconnect elements or routing (see Figure 1-2). Actel provides two types of logic modules, the register cell (R-cell) and the combinatorial cell (C-cell). The R-cell contains a flip-flop featuring more control signals than in previous Actel architectures, including asynchronous clear, asynchronous preset, and clock enable (using the S0 and S1 lines). The R-cell registers feature programmable clock polarity, selectable on a register-by-register basis (Figure 1-3 on page 1-4). This provides the designer with additional flexibility while allowing mapping of synthesized functions into the SX FPGA. The clock source for the R-cell can be chosen from the hardwired clock or the routed clock. The C-cell implements a range of combinatorial functions with up to five inputs (Figure 1-4 on page 1-4). Inclusion of the DB input and its associated inverter function dramatically increases the number of combinatorial functions that can be implemented in a single module from 800 options in previous architectures to more than 4,000 in the SX architecture. An example of the improved flexibility enabled by the inversion capability is the ability to integrate a three-input exclusive-OR function into a single C-cell. This facilitates construction of ninebit parity-tree functions with 2 ns propagation delays. At the same time, the C-cell structure is extremely synthesisfriendly, simplifying the overall design and reducing synthesis time.
Channeled Array Architecture
Sea-of-Modules Architecture
Figure 1-2 * Channeled Array and Sea-of-Modules Architectures
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Routed Data Input S0 S1 PSETB Direct Connect Input D Q Y
HCLK CLKA CLKB CKS
Figure 1-3 * R-Cell
CLRB CKP
D0 D1
Y
D2 D3 Sa Sb
DB A0
Figure 1-4 * C-Cell
B0
A1
B1
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Chip Architecture
The SX family's chip architecture provides a unique approach to module organization and chip routing that delivers the best register/logic mix for a wide variety of new and emerging applications.
Module Organization
Actel has arranged all C-cell and R-cell logic modules into horizontal banks called Clusters. There are two types of Clusters: Type 1 contains two C-cells and one R-cell, and Type 2 contains one C-cell and two R-cells.
To increase design efficiency and device performance, Actel has further organized these modules into SuperClusters (see Figure 1-5). SuperCluster 1 is a twowide grouping of Type 1 Clusters. SuperCluster 2 is a twowide group containing one Type 1 Cluster and one Type 2 Cluster. SX devices feature more SuperCluster 1 modules than SuperCluster 2 modules because designers typically require more combinatorial logic than flip-flops.
R-Cell
Routed Data Input S1 PSETB Direct Connect Input
D2 D Q Y D3 D0 D1
C-Cell
S0
Y
Sa
Sb
HCLK CLKA CLKB CKS CKP
CLRB
DB A0 B0 A1 B1
Cluster 1
Cluster 2
Cluster 2
Cluster 1
Type 1 SuperCluster
Figure 1-5 * Cluster Organization
Type 2 SuperCluster
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SX Family FPGAs RadTolerant and HiRel
Routing Resources
Clusters and SuperClusters can be connected through the use of two innovative local routing resources called FastConnect and DirectConnect that enable extremely fast and predictable interconnections of modules within Clusters and SuperClusters (see Figure 1-6 and Figure 1-7 on page 1-7). This routing architecture also dramatically reduces the number of antifuses required to complete a circuit, ensuring the highest possible performance. DirectConnect is a horizontal routing resource that provides connections from a C-cell to its neighboring R-cell in a given SuperCluster. DirectConnect uses a hardwired signal path requiring no programmable interconnection to achieve its fast signal propagation time of less than 0.1 ns. FastConnect enables horizontal routing between any two logic modules within a given SuperCluster, and vertical routing to the SuperCluster immediately below it. Only one programmable connection is used in a FastConnect path, delivering a maximum pin-to-pin propagation of 0.4 ns. In addition to DirectConnect and FastConnect, the architecture makes use of two globally oriented routing resources known as segmented routing and high-drive routing. Actel's segmented routing structure provides a variety of track lengths for extremely fast routing between SuperClusters. The exact combination of track lengths and antifuses within each path is chosen by the 100% automatic place-and-route software to minimize signal propagation delays.
DirectConnect * No Antifuses
FastConnect * One Antifuse
Routing Segments * Typically Two Antifuses * Max. Five Antifuses
Type 1 SuperClusters
Figure 1-6 * DirectConnect and FastConnect for Type 1 SuperClusters
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DirectConnect * No Antifuses
FastConnect * One Antifuse
Routing Segments * Typically Two Antifuses * Max. Five antifuses
Type 2 SuperClusters
Figure 1-7 * DirectConnect and FastConnect for Type 2 SuperClusters
Clock Resources
Actel's high-drive routing structure provides three clock networks. The first clock, called HCLK, is hardwired from the HCLK buffer to the clock select MUX in each R-cell. HCLK cannot be connected to combinational logic. This provides a fast propagation path for the clock signal, enabling the 8.9 ns clock-to-out (pad-to-pad) performance of the RTSX devices. The hardwired clock is tuned to provide clock skew is less than 0.5 ns worst case. The remaining two clocks (CLKA and CLKB) are global clocks that can be sourced from external pins or from internal logic signals within the RTSX device. CLKA and CLKB may be connected to sequential cells or to combinational logic. If CLKA or CLKB is sourced from internal logic signals, then the external clock pin cannot be used for any other input and must be tied low or high. Figure 1-8 describes the clock circuit used for the constant load HCLK. Figure 1-9 describes the CLKA and CLKB circuit used in all RTSX devices with the exception of the RT54SX72S device.
Constant Load Clock Network HCLKBUF
Figure 1-8 * RTSX Constant Load Clock Pad
Clock Network
From Internal Logic CLKBUF CLKBUFI CLKINT CLKINTI
Figure 1-9 * RTSX Clock Pads
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SX Family FPGAs RadTolerant and HiRel
Other Architecture
Performance
The combination of architectural features described above enables RT54SX devices to operate with internal clock frequencies exceeding 160 MHz, enabling very fast execution of complex logic functions. Thus, the RTSX family is an optimal platform upon which to integrate the functionality previously contained in multiple CPLDs. In addition, designs that previously would have required a gate array to meet performance goals can now be integrated into an RTSX device with dramatic improvements in cost and time-to-market. Using timingdriven place-and-route tools, designers can achieve highly deterministic device performance. With RTSX devices, there is no need to use complicated performance-enhancing design techniques such as redundant logic to reduce fanout on critical nets, or the instantiation of macros in HDL code to achieve high performance.
Power Requirements
The RTSX family supports either 3.3 V or 5.0 V I/O voltage operation and is designed to tolerate 5 V inputs in each case (Table 1-1). Power consumption is extremely low due to the very short distances signals are required to travel to complete a circuit. Power requirements are further reduced due to the small number of antifuses in the path, and because of the low resistance properties of the antifuses. The antifuse architecture does not require active circuitry to hold a charge (as do SRAM or EPROM), making it the lowest-power architecture on the market.
Table 1-1 * Supply Voltages Maximum Maximum Input Output Tolerance Drive 5.0 V 5.0 V 3.3 V 3.3 V
VCCA A54SX16 A54SX32 RTSX16 RTSX32 3.3 V 3.3 V
VCCI 3.3 V 3.3 V
VCCR 5.0 V 5.0 V
I/O Modules
Each I/O on an RTSX device can be configured as an input, an output, a tristate output, or a bidirectional pin. Even without the inclusion of dedicated registers, these I/Os, in combination with array registers, can achieve clock-to-out (PAD-to-PAD) timing as fast as 5.8 ns. I/O cells including embedded latches and flip-flops require instantiation in HDL code. This is a design complication not encountered in RTSX FPGAs. Fast PAD-to-PAD timing ensures that the device will have little trouble interfacing with any other device in the system, which in turn enables parallel design of system components and reduces overall design time.
Boundary Scan Testing (BST)
All RTSX devices are IEEE 1149.1 (JTAG) compliant. They offer superior diagnostic and testing capabilities by providing BST and probing capabilities. These functions are controlled through the special test pins in conjunction with the program fuse. The functionality of each pin is described in Table 1-2. Figure 1-10 on page 1-9 is a block diagram of the RTSX JTAG circuitry.
Table 1-2 * Boundary Scan Pin Functionality Program Fuse Blown (Dedicated Test Mode) Program Fuse Not Blown (Flexible Mode)
TCK, TDI, TDO are dedicated TCK, TDI, TDO are flexible and test pins may be used as I/Os No need for pull-up resistor for Use a pull-up resistor of TMS 10 k on TMS
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TDI
Data Registers (DRs)
0 1 Instruction Register (IR)
Output Stage
TDO
Clocks and/or Controls
TMS TCK TRST External Hardwired Pin
Figure 1-10 * RTSX JTAG Circuitry
TAP Controller
Configuring Diagnostic Pins
The JTAG and Probe pins (TDI, TCK, TMS, TDO, PRA, and PRB) are placed in the desired mode by selecting the appropriate check boxes in the Variation dialog window. This dialog window is accessible through the Design Setup Wizard under the Tools menu in the Actel Designer software.
Dedicated Test Mode
When the Reserve JTAG check box is selected in the Designer software, the RTSX is placed in Dedicated Test mode, which configures the TDI, TCK, and TDO pins for BST or in-circuit verification with Silicon Explorer II. An internal pull-up resistor is automatically enabled on both the TMS and TDI pins. In dedicated test mode, TCK, TDI, and TDO are dedicated test pins and become unavailable for pin assignment in the Pin Editor. The TMS pin will function as specified in the IEEE 1149.1 (JTAG) Specification.
TRST Pin
The TRST pin functions as a Boundary Scan Reset pin. The TRST pin is an asynchronous, active-low input to initialize or reset the BST circuit. An internal pull-up resistor is automatically enabled on the TRST pin.
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Flexible Mode
When the Reserve JTAG check box is cleared (the default setting in the Designer software), the RTSX is placed in flexible mode, which allows the TDI, TCK, and TDO pins to function as user I/Os or BST pins. In this mode the internal pull-up resistors on the TMS and TDI pins are disabled. An external 10 k pull-up resistor to VCCI is required on the TMS pin. The TDI, TCK, and TDO pins are transformed from user I/Os into BST pins when a rising edge is detected on TCK while TMS is at logical low. Once the BST pins are in test mode they will remain in BST mode until the internal BST state machine reaches the "logic reset" state. At this point the BST pins will be released and will function as regular I/O pins. The "logic reset" state is reached five TCK cycles after the TMS pin is set to logical HIGH. The program fuse determines whether the device is in Dedicated Test or Flexible mode. The default (fuse not programmed) is Flexible mode.
Actel Designer software is a place-and-route tool and provides a comprehensive suite of back-end support tools for FPGA development. The Designer software includes timing-driven place-and-route and a world-class integrated static timing analyzer and constraints editor. With the Designer software, a user can lock his/her design pins before layout while minimally impacting the results of place-and-route. Additionally, the backannotation flow is compatible with all the major simulators and the simulation results can be cross-probed with Silicon Explorer II, the Actel integrated verification and logic analysis tool. Another tool included in the Designer software is the ACTgen macro builder, which easily creates popular and commonly used logic functions for implementation in your schematic or HDL design. Actel Designer software is compatible with the most popular FPGA design entry and verification tools from companies such as Mentor Graphics, Synplicity, Synopsys, and Cadence Design Systems. The Designer software is available for both the Windows and UNIX
operating systems.
Development Tool Support
The RTSX family of FPGAs is fully supported by both Actel Libero(R) Integrated Design Environment (IDE) and Designer FPGA Development software. Actel Libero IDE is a design management environment that streamlines the design flow. Libero IDE provides an integrated design manager that seamlessly integrates design tools while guiding the user through the design flow, managing all design and log files, and passing necessary design data among tools. Additionally, Libero IDE allows users to integrate both schematic and HDL synthesis into a single flow and verify the entire design in a single environment. Libero IDE includes Synplify(R) for Actel from Synplicity(R), ViewDraw(R) for Actel from Mentor Graphics(R), ModelSimTM HDL Simulator from Mentor Graphics, WaveFormer LiteTM from SynaptiCADTM, and Designer software from Actel. Refer to the Libero IDE Design Flow (located on the Actel website) diagram for more information.
RTSX Probe Circuit Control Pins
The RTSX RadTolerant devices contain internal probing circuitry that provides built-in access to every node in a design, enabling 100-percent real-time observation and analysis of a device's internal logic nodes without design iteration. The probe circuitry is accessed using Silicon Explorer II, an easy-to-use integrated verification and logic analysis tool that can sample data at 100 MHz (asynchronous) or 66 MHz (synchronous). Silicon Explorer attaches to a PC's standard COM port, turning the PC into a fully functional 18-channel logic analyzer. Silicon Explorer allows designers to complete the design verification process at their desks and reduces verification time from several hours per cycle to a few seconds. The Silicon Explorer II tool uses the boundary scan ports (TDI, TRST, TCK, TMS, and TDO) to select the desired nets for verification. The selected internal nets are assigned to the PRA/PRB pins for observation. Figure 1-11 on page 1-11 illustrates the interconnection between Silicon Explorer II and the FPGA to perform in-circuit verification.
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Design Considerations
For prototyping, the TDI, TCK, TDO, PRA, and PRB pins should not be used as input or bidirectional ports. Because these pins are active during probing, critical signals input through these pins are not available while probing. In addition, the security fuse should not be programmed during prototyping because doing so disables the probe circuitry.
Channels
16
RTSX-S FPGA TRST TCK TMS Serial Connection Silicon Explorer II TDO
PRA PRB
Figure 1-11 * Probe Setup
Related Documents
Datasheets
54SX Family FPGAs http://www.actel.com/documents/A54SXDS.pdf
Application Notes
Power-Up and Power-Down Behavior of 54SX and RT54SX Devices http://www.actel.com/documents/PowerUpAN.pdf
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3.3 V / 5 V Operating Conditions
Recommended Operating Conditions
Table 1-3 * Absolute Maximum Ratings Symbol VCCR VCCA VCCI VI VO IIO TSTG Notes: 1. Stresses beyond those listed in Table 1-3 may cause permanent damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Device should not be operated outside the Recommended Operating Conditions. 2. The I/O source sink numbers refer to tristated inputs and outputs Table 1-4 * Recommended Operating Conditions Parameter Temperature Range1 Commercial 0 to +70 10 5 Military -55 to +125 10 10 Units C %VCC %VCC DC Supply Voltage DC Supply Voltage DC Supply Voltage Input Voltage Output Voltage I/O Source Sink Current2 Storage Temperature -40 to +125 C Parameter Limits -0.3 to +6.0 -0.3 to +4.0 -0.3 to +4.0 -0.5 to +5.5 -0.5 to +3.6 -30 to +5.0 Units V V V V V mA
3.3 V Power2 Supply Tolerance 5 V Power Supply 2 Tolerance Notes:
1. Ambient temperature (TA) is used for commercial and industrial; case temperature (TC) is used for military. 2. All power supplies must be in the recommended operating range for 250 s. For more information, refer to the Power-Up and Power-Down Behavior of 54SX and RT54SX Devices application note.
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Electrical Specifications
Table 1-5 * Electrical Specifications Commercial Symbol VOH Parameter (IOH = -20 A) (CMOS) (IOH = -8 mA) (TTL) (IOH = -6 mA) (TTL) VOL (IOL = 20 A) (CMOS) (IOL = 12 mA) (TTL) (IOL = 8 mA) (TTL) VIL VIH tR, tF CIO ICC ICC(D) Low Level Inputs High Level Inputs Input Transition Time tR, tF CIO I/O Capacitance Standby Current, ICC ICC(D) IDynamic VCC Supply Current 2.0 50 10 4.0 0.8 2.0 50 10 25 0.10 0.50 0.50 0.8 V V ns pF mA Min. (VCCI - 0.1) 2.4 Max. VCCI VCCI 2.4 VCCI V Military Min. (VCCI - 0.1) Max. VCCI Units V
See the "Power Dissipation" section on page 1-15.
Power-Up Sequencing
Table 1-6 * RT54SX16, A54SX16, RT54SX32, A54SX32 VCCA 3.3 V VCCR 5.0 V VCCI 3.3 V Power-Up Sequence 5.0 V First 3.3 V Second 3.3 V First 5.0 V Second Comments No possible damage to device Possible damage to device
Power-Down Sequencing
Table 1-7 * RT54SX16, A54SX16, RT54SX32, A54SX32 VCCA 3.3 V VCCR 5.0 V VCCI 3.3 V Power-Down Sequence 5.0 V First 3.3 V Second 3.3 V First 5.0 V Second Comments Possible damage to device No possible damage to device
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SX Family FPGAs RadTolerant and HiRel
Package Thermal Characteristics
The device junction-to-case thermal characteristic is jc, and the junction-to-ambient air characteristic is ja. The thermal characteristics for ja are shown with two different air flow rates. Maximum junction temperature is 150C. A sample calculation of the absolute maximum power dissipation allowed for an RT54SX16 in a CQFP 256-pin package at military temperature and still air is shown in EQ 1-1: Max. junction temp. (C) - Max. ambient temp. (C) 150C - 125C Absolute Maximum Power Allowed = ------------------------------------------------------------------------------------------------------------------------------------ = -------------------------------------- = 1.09 W ja (C/W) 23C/W
EQ 1-1 Table 1-8 * Package Thermal Characteristics Package Type RT54SX16 Ceramic Quad Flat Pack (CQFP) Ceramic Quad Flat Pack (CQFP) RT54SX32 Ceramic Quad Flat Pack (CQFP) Ceramic Quad Flat Pack (CQFP) A54SX16 Ceramic Quad Flat Pack (CQFP) Ceramic Quad Flat Pack (CQFP) A54SX32 Ceramic Quad Flat Pack (CQFP) Ceramic Quad Flat Pack (CQFP) 208 256 7.6 4.8 30 24 C/W C/W 208 256 7.9 5.6 30 25 C/W C/W 208 256 6.9 3.5 35 20 C/W C/W 208 256 7.5 4.6 29 23 C/W C/W Pin Count jc ja Still Air Units
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SX Family FPGAs RadTolerant and HiRel
Power Dissipation
P = (ICCstandby + ICCactive) * VCCA + IOL * VOL * N + IOH * (VCCA - VOH) * M
EQ 1-2
Active Power Component
Power dissipation in CMOS devices is usually dominated by the active (dynamic) power dissipation. This component is frequency-dependent, a function of the logic and the external I/O. Active power dissipation results from charging the internal chip capacitances of the interconnects, unprogrammed antifuses, module inputs, and module outputs, plus external capacitance due to PCB traces and load device inputs. An additional component of the active power dissipation is the totem pole current in CMOS transistor pairs. The net effect can be associated with an equivalent capacitance that can be combined with frequency and voltage to represent active power dissipation.
where: ICCstandby is the current flowing when no inputs or outputs are changing. ICCactive is the current flowing due to CMOS switching. IOL, IOH are TTL sink/source currents. VOL, VOH are TTL level output voltages. N is the number of outputs driving TTL loads to VOL. M is the number of outputs driving TTL loads to VOH. Accurate values for N and M are difficult to determine because they depend on the design and on the system I/O. The power can be divided into two components: static and active.
Equivalent Capacitance
The power dissipated by a CMOS circuit can be expressed by EQ 1-3: Power (W) = CEQ * VCCA2 * F
EQ 1-3
Static Power Component
Power consumption due to standby current is typically a small component of the total power consumption. Standby power is shown below for military, worst-case conditions (70C). ICC 20 mA VCC 3.6 V Power 72 mW
where: CEQ VCCA F = Equivalent capacitance in pF = Power supply in volts (V) = Switching frequency in MHz
Equivalent capacitance is calculated by measuring ICCactive at a specified frequency and voltage for each circuit component of interest. Measurements have been made over a range of frequencies at a fixed value of VCCA. Equivalent capacitance is frequency-independent so that the results may be used over a wide range of operating conditions. Equivalent capacitance values are shown in Table 1-9.
Table 1-9 * Equivalent Capacitance Values RT54SX16 Equivalent Capacitance (pF) Modules Input Buffers Output Buffers Routed Array Clock Buffer Loads Dedicated Clock Buffer Loads Fixed Capacitance (pF) routed_Clk1 routed_Clk2 Fixed Clock Loads Clock Loads on Dedicated Array Clock s1 528 528 1,080 1,080 r1 r2 120 120 60 60 210 210 107 107 CEQM CEQI CEQO CEQCR CEQCD 7.0 2.0 10.0 0.4 0.25 3.9 1.0 5.0 0.2 0.15 7.0 2.0 10.0 0.6 0.34 3.9 1.0 5.0 0.3 0.23 A54SX16 RT54SX32 A54SX32
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SX Family FPGAs RadTolerant and HiRel
CEQ Values (pF)
To calculate the active power dissipated by the complete design, the switching frequency of each part of the logic must be known. EQ 1-4 shows a piecewise linear summation over all components. Power = VCCA2 * [(m * CEQM * fm)modules + (n * CEQI * fn)inputs+ (p * (CEQO + CL) * fp)outputs+ 0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 * fq1)routed_Clk1 + 0.5 * (q2 * CEQCR * fq2)routed_Clk2+ (r2 * fq2)routed_Clk2 + 0.5 * (s1 * CEQCD * fs1)dedicated_CLK]
EQ 1-4
Determining Average Switching Frequency
To determine the switching frequency for a design, you must have a detailed understanding of the data input values to the circuit. The following guidelines are meant to represent worst-case scenarios so they can be generally used to predict the upper limits of power dissipation. Logic Modules (m) Inputs Switching (n) Outputs Switching (p) = = = 80% of modules # inputs/4 # output/4 40% of sequential modules 40% of sequential modules 35 pF F/10 F/5 F/10 F/2 F/2 F
where: m n p q1 q2 r1 r2 s1 CEQM CEQI CEQO CEQCR CEQCD CL fm fn fp fq1 fq2 = Number of logic modules switching at fm = Number of input buffers switching at fn = Number of output buffers switching at fp = Number of clock loads on the first routed array clock = Number of clock loads on the second routed array clock = Fixed capacitance due to first routed array clock = Fixed capacitance due to second routed array clock = Fixed number of clock loads on the dedicated array clock (528 for A54SX16) = Equivalent capacitance of logic modules in pF = Equivalent capacitance of input buffers in pF = Equivalent capacitance of output buffers in pF = Equivalent capacitance of routed array clock in pF = Equivalent capacitance of dedicated array clock in pF = Output lead capacitance in pF = Average logic module switching rate in MHz = Average input buffer switching rate in MHz = Average output buffer switching rate in MHz = Average first routed array clock rate in MHz = Average second routed array clock rate in MHz
First Routed Array Clock Loads (q1) = Second Routed Array Clock Loads = (q2) Load Capacitance (CL) = Average Logic Module Switching = Rate (fm) Average Input Switching Rate (fn) = Average Output Switching Rate (fp) = Average First Routed Array Clock = Rate (fq1) Average Second Routed Array = Clock Rate (fq2) Average Dedicated Array Clock = Rate (fs1)
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Temperature and Voltage Derating Factors
Table 1-10 * Temperature and Voltage Derating Factors (Normalized to Worst-Case Commercial, TJ = 70C, VCCA = 3.0 V) Junction Temperature (TJ) VCCA 3.0 3.3 3.6 -40 0.78 0.73 0.69 0 0.87 0.82 0.77 25 0.89 0.83 0.78 70 1.00 0.93 0.87 85 1.04 0.97 0.92 125 1.16 1.08 1.02
SX Timing Model
Input Delays I/O Module t INY = 2.2 ns tIRD2 = 1.2 ns tDHL = 2.8 ns tPD = 0.9 ns tRD1 = 0.7 ns tRD4 = 2.2 ns tRD8 = 4.3 ns Internal Delays Combinatorial Cell Predicted Routing Delays Output Delays I/O Module
I/O Module tDLH = 2.8 ns
Register Cell
Register Cell
D tSUD = 0.8 ns tHD = 0.0 ns
Q
tRD1 = 0.7 ns
D
Q
tRD1 = 0.7 ns
tENZH = 2.8 ns
Routed Clock
tRCO = 0.6 ns tRCKH = 2.8 ns (100% Load) FMAX = 175 MHz
tRCO = 0.6 ns
Hardwired Clock
tHCKH = 1.3 ns FHMAX = 240 MHz
Note: Values shown for A54SX16-1 at worst-case commercial conditions. Figure 1-12 * SX Timing Model
Hardwired Clock
External Setup Clock-to-Out (Pin-to-Pin) = = = = tINY + tIRD1 + tSUD - tHCKH 2.2 + 0.7 + 0.8 - 1.7 = 2.0 ns tHCKH + tRCO + tRD1 + tDHL 1.7 + 0.6 + 0.7 + 2.8 = 5.8 ns
Routed Clock
External Setup Clock-to-Out (Pin-to-Pin) = = = =
tINY + tIRD1 + tSUD - tRCKH 2.2 + 0.7 + 0.8 - 2.4 = 1.3 ns tRCKH + tRCO + tRD1 + tDHL 2.4 + 0.6 + 0.7 + 2.8 = 6.5 ns
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SX Family FPGAs RadTolerant and HiRel
E D TRIBUFF PAD To AC Test Loads (shown below)
VCC In Out VOL 50% 50% VOH 1.5 V tDLH tDHL GND 1.5 V En Out
VCC 50% VCC 50% 1.5 V VOL tENZL tENLZ GND 10% En Out GND
VCC 50% 50% VOH 1.5 V tENZH GND 90%
tENHZ
Figure 1-13 * Output Buffer Delays
Load 1 (Used to measure propagation delay) To the Output Under Test 50 pF To the Output Under Test Load 2 (Used to Measure rising/falling delays) VCC GND
R to VCC for tPLZ/tPZL R to GND for tPHZ/tPZL R = 1 k 50 pF
Figure 1-14 * AC Test Loads
PAD
INBUF
Y
S A B
Y
VCC
S, A or B 3V In Out GND tINY 1.5 V 1.5 V VC C 50% tINY 0V 50% Out 50% tPD GND tPD Out GND tPD 50% 50% GND 50% tPD
VCC
50%
VCC
50%
Figure 1-15 * Input Buffer Delays
Figure 1-16 * C-Cell Delays
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D CLK
PRESET CLR
Q
(Positive Edge Triggered)
tHD D tSUD CLK tHPWH' tRPWH tHPWL' tRPWL tHP
tRCO Q
tCLR CLR tWASYN PRESET
tPRESET
Figure 1-17 * Register Cell Timing Characteristics - Flip-Flops
Timing Characteristics
Timing characteristics for SX devices fall into three categories: family-dependent, device-dependent, and design-dependent. The input and output buffer characteristics are common to all SX family members. Internal routing delays are device-dependent. Design dependence means actual delays are not determined until after placement and routing of the user's design is complete. Delay values may then be determined by using the Timer tool or performing simulation with post-layout delays.
Long Tracks
Some nets in the design use long tracks. Long tracks are special routing resources that span multiple rows, columns, or modules. Long tracks employ three and sometimes five antifuse connections. This increases capacitance and resistance, resulting in longer net delays for macros connected to long tracks. Typically up to 6 percent of nets in a fully utilized device require long tracks. Long tracks contribute approximately 4 ns to 8.4 ns delay. This additional delay is represented statistically in higher fanout (FO = 24) routing delays in the data sheet specifications section.
Critical Nets and Typical Nets
Propagation delays are expressed only for typical nets, which are used for initial design performance evaluation. Critical net delays can then be applied to the most timecritical paths. Critical nets are determined by net property assignment prior to placement and routing. Up to 6 percent of the nets in a design may be designated as critical, whereas 90 percent of the nets in a design are typical.
Timing Derating
SX devices are manufactured in a CMOS process. Therefore, device performance varies according to temperature, voltage, and process variations. Minimum timing parameters reflect maximum operating voltage, minimum operating temperature, and best-case processing. Maximum timing parameters reflect minimum operating voltage, maximum operating temperature, and worst-case processing.
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SX Family FPGAs RadTolerant and HiRel
A54SX16 Timing Characteristics
Table 1-11 * A54SX16 (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter C-Cell Propagation tPD tDC tFC tRD1 tRD2 tRD3 tRD4 tRD8 tRD12 tRD18 tRD24 R-Cell Timing tRCO tCLR tSUD tHD tWASYN tINYH tINYL tIRD1 tIRD2 tIRD3 tIRD4 tIRD8 tIRD12 tIRD18 tIRD24 Notes: 1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate. 2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is based on actual routing delay measurements performed on the device prior to shipment. Sequential Clock-to-Q Asynchronous Clear-to-Q Flip-Flop Data Input Setup Flip-Flop Data Input Hold Asynchronous Pulse Width 0.8 0.0 2.4 0.6 0.6 0.9 0.0 2.9 0.8 0.8 ns ns ns ns ns Delays1 0.9 1.0 ns Description Min. Max. 'Std' Speed Min. Max. Units
Internal Array Module Delays2
Predicted Routing
FO = 1 Routing Delay, Direct Connect FO = 1 Routing Delay, Fast Connect FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
0.1 0.6 0.7 1.2 1.7 2.2 4.3 5.6 9.4 12.4
0.1 0.7 0.8 1.4 2.0 2.6 5.0 6.6 11.0 14.6
ns ns ns ns ns ns ns ns ns ns
I/O Module Input Propagation Delays Input Data Pad-to-Y HIGH Input Data Pad-to-Y LOW Delays2 0.7 1.2 1.7 2.2 4.3 5.6 9.4 12.4 0.8 1.4 2.0 2.6 5.0 6.6 11.0 14.6 ns ns ns ns ns ns ns ns 2.2 2.2 2.6 2.6 ns ns
Predicted Input Routing
FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
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Table 1-12 * A54SX16 (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter Description Min. Max. 'Std' Speed Min. Max. Units
I/O Module - TTL Output Timing* tDLH tDHL tENZL tENZH tENLZ tENHZ dTLH dTHL tHCKH tHCKL tHPWH tHPWL tHCKSW tHP fHMAX tRCKH tRCKL tRCKH tRCKL tRCKH tRCKL tRPWH tRPWL tRCKSW tRCKSW tRCKSW Data-to-Pad LOW to HIGH Data-to-Pad HIGH to LOW Enable-to-Pad, Z to LOW Enable-to-Pad, Z to HIGH Enable-to-Pad, LOW to Z Enable-to-Pad, HIGH to Z Delta LOW to HIGH Delta HIGH to LOW 2.8 2.8 2.3 2.8 4.5 2.2 0.05 0.05 3.3 3.3 2.8 3.3 5.2 2.6 0.06 0.08 ns ns ns ns ns ns ns/pF ns/pF
Dedicated (Hardwired) Array Clock Network Input LOW to HIGH (Pad to R-Cell Input) Input HIGH to LOW (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew Minimum Period Maximum Frequency 4.2 240 2.1 2.1 0.4 4.9 205 1.7 1.9 2.4 2.4 0.4 2.0 2.2 ns ns ns ns ns ns MHz
Routed Array Clock Networks Input LOW to HIGH (Light Load) (Pad to R-Cell Input) Input HIGH to LOW (Light Load) (Pad to R-Cell Input) Input LOW to HIGH (50% Load) (Pad to R-Cell Input) Input HIGH to LOW (50% Load) (Pad to R-Cell Input) Input LOW to HIGH (100% Load) (Pad to R-Cell Input) Input HIGH to LOW (100% Load) (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew (Light Load) Maximum Skew (50% Load) Maximum Skew (100% Load) 3.1 3.1 0.6 0.8 0.8 2.4 2.7 2.9 2.9 2.8 2.9 3.7 3.7 0.8 0.9 0.9 2.9 3.1 3.3 3.5 3.3 3.5 ns ns ns ns ns ns ns ns ns ns ns
Note: *Delays based on 35 pF loading, except for tENZL and tENZH. For tENZL and tENZH, the loading is 5 pF.
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SX Family FPGAs RadTolerant and HiRel
RT54SX16 Timing Characteristics
Table 1-13 * RT54SX16 (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter C-Cell Propagation tPD tDC tFC tRD1 tRD2 tRD3 tRD4 tRD8 tRD12 tRD18 tRD24 R-Cell Timing tRCO tCLR tSUD tHD tWASYN tINYH tINYL tIRD1 tIRD2 tIRD3 tIRD4 tIRD8 tIRD12 tIRD18 tIRD24 Notes: 1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate. 2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is based on actual routing delay measurements performed on the device prior to shipment. Sequential Clock-to-Q Asynchronous Clear-to-Q Flip-Flop Data Input Setup Flip-Flop Data Input Hold Asynchronous Pulse Width 2.0 0.0 4.4 1.5 1.5 2.2 0.0 5.3 2.0 2.0 ns ns ns ns ns Delays1 1.7 1.8 ns Description Min. Max. 'Std' Speed Min. Max. Units
Internal Array Module Delays2
Predicted Routing
FO = 1 Routing Delay, Direct Connect FO = 1 Routing Delay, Fast Connect FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
0.2 1.1 1.3 2.2 3.1 4.0 7.8 10.1 17.0 22.4
0.2 1.3 1.5 2.6 3.6 4.7 9.0 11.9 19.8 26.3
ns ns ns ns ns ns ns ns ns ns
I/O Module Input Propagation Delays Input Data Pad-to-Y HIGH Input Data Pad-to-Y LOW Delays2 1.3 2.2 3.1 4.0 7.8 10.1 17.0 22.4 1.5 2.6 3.6 4.7 9.0 11.9 19.8 26.3 ns ns ns ns ns ns ns ns 4.0 4.0 4.7 4.7 ns ns
Predicted Input Routing
FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
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Table 1-14 * RT54SX16 (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter Description Min. Max. 'Std' Speed Min. Max. Units
I/O Module - TTL Output Timing* tDLH tDHL tENZL tENZH tENLZ tENHZ dTLH dTHL tHCKH tHCKL tHPWH tHPWL tHCKSW tHP fHMAX tRCKH tRCKL tRCKH tRCKL tRCKH tRCKL tRPWH tRPWL tRCKSW tRCKSW tRCKSW Data-to-Pad LOW to HIGH Data-to-Pad HIGH to LOW Enable-to-Pad, Z to LOW Enable-to-Pad, Z to HIGH Enable-to-Pad, LOW to Z Enable-to-Pad, HIGH to Z Delta LOW to HIGH Delta HIGH to LOW 5.1 5.1 4.2 5.1 8.1 4.0 0.09 0.09 6.0 6.0 5.1 6.0 9.4 4.7 0.11 0.15 ns ns ns ns ns ns ns/pF ns/pF
Dedicated (Hardwired) Array Clock Network Input LOW to HIGH (Pad to R-Cell Input) Input HIGH to LOW (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew Minimum Period Maximum Frequency 7.6 130 3.8 3.8 0.8 8.9 110 3.1 3.5 4.4 4.4 0.8 3.6 4.0 ns ns ns ns ns ns MHz
Routed Array Clock Networks Input LOW to HIGH (Light Load) (Pad to R-Cell Input) Input HIGH to LOW (Light Load) (Pad to R-Cell Input) Input LOW to HIGH (50% Load) (Pad to R-Cell Input) Input HIGH to LOW (50% Load) (Pad to R-Cell Input) Input LOW to HIGH (100% Load) (Pad to R-Cell Input) Input HIGH to LOW (100% Load) (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew (Light Load) Maximum Skew (50% Load) Maximum Skew (100% Load) 5.6 5.6 1.1 1.5 1.5 4.4 4.9 5.3 5.3 5.1 5.3 6.7 6.7 1.5 1.7 1.7 5.3 5.6 6.0 6.3 6.0 6.3 ns ns ns ns ns ns ns ns ns ns ns
Note: *Delays based on 35 pF loading, except for tENZL and tENZH. For tENZL and tENZH the loading is 5 pF.
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SX Family FPGAs RadTolerant and HiRel
A54SX32 Timing Characteristics
Table 1-15 * A54SX32 Timing Characteristics (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter C-Cell Propagation tPD tDC tFC tRD1 tRD2 tRD3 tRD4 tRD8 tRD12 tRD18 tRD24 R-Cell Timing tRCO tCLR tSUD tHD tWASYN tINYH tINYL tIRD1 tIRD2 tIRD3 tIRD4 tIRD8 tIRD12 tIRD18 tIRD24 Notes: 1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate. 2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is based on actual routing delay measurements performed on the device prior to shipment. Sequential Clock-to-Q Asynchronous Clear-to-Q Flip-Flop Data Input Set-Up Flip-Flop Data Input Hold Asynchronous Pulse Width 0.8 0.0 2.4 0.6 0.6 0.9 0.0 2.9 0.8 0.8 ns ns ns ns ns Delays1 0.9 1.0 ns Description Min. Max. 'Std' Speed Min. Max. Units
Internal Array Module Delays2
Predicted Routing
FO = 1 Routing Delay, Direct Connect FO = 1 Routing Delay, Fast Connect FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
0.1 0.6 0.7 1.2 1.7 2.2 4.3 5.6 9.4 12.4
0.1 0.7 0.8 1.4 2.0 2.6 5.0 6.6 11.0 14.6
ns ns ns ns ns ns ns ns ns ns
I/O Module Input Propagation Delays Input Data Pad-to-Y HIGH Input Data Pad-to-Y LOW Delays2 0.7 1.2 1.7 2.2 4.3 5.6 9.4 12.4 0.8 1.4 2.0 2.6 5.0 6.6 11.0 14.6 ns ns ns ns ns ns ns ns 2.2 2.2 2.6 2.6 ns ns
Predicted Input Routing
FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
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Table 1-16 * A54SX32 Timing Characteristics (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter Description Min. Max. 'Std' Speed Min. Max. Units
I/O Module - TTL Output Timing* tDLH tDHL tENZL tENZH tENLZ tENHZ dTLH dTHL tHCKH tHCKL tHPWH tHPWL tHCKSW tHP fHMAX tRCKH tRCKL tRCKH tRCKL tRCKH tRCKL tRPWH tRPWL tRCKSW tRCKSW tRCKSW Data-to-Pad LOW to HIGH Data-to-Pad HIGH to LOW Enable-to-Pad, Z to LOW Enable-to-Pad, Z to HIGH Enable-to-Pad, LOW to Z Enable-to-Pad, HIGH to Z Delta LOW to HIGH Delta HIGH to LOW 2.8 2.8 2.3 2.8 4.5 2.2 0.05 0.05 3.3 3.3 2.8 3.3 5.2 2.6 0.06 0.08 ns ns ns ns ns ns ns/pF ns/pF
Dedicated (Hardwired) Array Clock Network Input LOW to HIGH (Pad to R-Cell Input) Input HIGH to LOW (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew Minimum Period Maximum Frequency 4.2 240 2.1 2.1 0.4 4.8 205 1.7 1.9 2.4 2.4 0.4 2.0 2.2 ns ns ns ns ns ns MHz
Routed Array Clock Networks Input LOW to HIGH (Light Load) (Pad to R-Cell Input) Input HIGH to LOW (Light Load) (Pad to R-Cell Input) Input LOW to HIGH (50% Load) (Pad to R-Cell Input) Input HIGH to LOW (50% Load) (Pad to R-Cell Input) Input LOW to HIGH (100% Load) (Pad to R-Cell Input) Input HIGH to LOW (100% Load) (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew (Light Load) Maximum Skew (50% Load) Maximum Skew (100% Load) 3.1 3.1 0.6 0.8 0.8 2.4 2.7 2.9 2.9 2.8 2.9 3.7 3.7 0.8 0.9 0.9 2.9 3.1 3.3 3.5 3.3 3.5 ns ns ns ns ns ns ns ns ns ns ns
Note: *Delays based on 35 pF loading, except tENZL and tENZH. For tENZL and tENZH the loading is 5 pF.
v2.1
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SX Family FPGAs RadTolerant and HiRel
RT54SX32 Timing Characteristics
Table 1-17 * RT54SX32 Timing Characteristics (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter C-Cell Propagation tPD tDC tFC tRD1 tRD2 tRD3 tRD4 tRD8 tRD12 tRD18 tRD24 R-Cell Timing tRCO tCLR tSUD tHD tWASYN tINYH tINYL tIRD1 tIRD2 tIRD3 tIRD4 tIRD8 tIRD12 tIRD18 tIRD24 Notes: 1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate. 2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is based on actual routing delay measurements performed on the device prior to shipment. Sequential Clock-to-Q Asynchronous Clear-to-Q Flip-Flop Data Input Set-Up Flip-Flop Data Input Hold Asynchronous Pulse Width 2.0 0.0 4.4 1.5 1.5 2.2 0.0 5.3 2.0 2.0 ns ns ns ns ns Delays1 1.7 1.8 ns Description Min. Max. 'Std' Speed Min. Max. Units
Internal Array Module Delays2
Predicted Routing
FO = 1 Routing Delay, Direct Connect FO = 1 Routing Delay, Fast Connect FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
0.2 1.1 1.3 2.2 3.1 4.0 7.8 10.1 17.0 22.4
0.2 1.3 1.5 2.6 3.6 4.7 9.0 11.9 19.8 26.3
ns ns ns ns ns ns ns ns ns ns
I/O Module Input Propagation Delays Input Data Pad-to-Y HIGH Input Data Pad-to-Y LOW Delays2 1.3 2.2 3.1 4.0 7.8 10.1 17.0 22.4 1.5 2.6 3.6 4.7 9.0 11.9 19.8 26.3 ns ns ns ns ns ns ns ns 4.0 4.0 4.7 4.7 ns ns
Predicted Input Routing
FO = 1 Routing Delay FO = 2 Routing Delay FO = 3 Routing Delay FO = 4 Routing Delay FO = 8 Routing Delay FO = 12 Routing Delay FO = 18 Routing Delay FO = 24 Routing Delay
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Table 1-18 * RT54SX32 Timing Characteristics (Worst-Case Military Conditions, VCCR = 4.75 V, VCCA, VCCI = 3.0 V, TJ = 125C) '-1' Speed Parameter Description Min. Max. 'Std' Speed Min. Max. Units
I/O Module - TTL Output Timing* tDLH tDHL tENZL tENZH tENLZ tENHZ dTLH dTHL Data-to-Pad LOW to HIGH Data-to-Pad HIGH to LOW Enable-to-Pad, Z to LOW Enable-to-Pad, Z to HIGH Enable-to-Pad, LOW to Z Enable-to-Pad, HIGH to Z Delta LOW to HIGH Delta HIGH to LOW 5.1 5.1 4.2 5.1 8.1 4.0 0.09 0.09 6.0 6.0 5.1 6.0 9.4 4.7 0.11 0.15 ns ns ns ns ns ns ns/pF ns/pF
Dedicated (Hardwired) Array Clock Network tHCKH tHCKL tHPWH tHPWL tHCKSW tHP fHMAX Input LOW to HIGH (Pad to R-Cell Input) Input HIGH to LOW (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW Maximum Skew Minimum Period Maximum Frequency 7.6 130 3.8 3.8 0.8 8.9 110 3.1 3.5 4.4 4.4 0.8 3.6 4.0 ns ns ns ns ns ns MHz
Routed Array Clock Networks tRCKH tRCKL tRCKH tRCKL tRCKH tRCKL tRPWH tRPWL Input LOW to HIGH (Light Load) (Pad to R-Cell Input) Input HIGH to LOW (Light Load) (Pad to R-Cell Input) Input LOW to HIGH (50% Load) (Pad to R-Cell Input) Input HIGH to LOW (50% Load) (Pad to R-Cell Input) Input LOW to HIGH (100% Load) (Pad to R-Cell Input) Input HIGH to LOW (100% Load) (Pad to R-Cell Input) Minimum Pulse Width HIGH Minimum Pulse Width LOW 5.6 5.6 4.4 4.9 5.3 5.3 5.1 5.3 6.7 6.7 5.3 5.6 6.0 6.3 6.0 6.3 ns ns ns ns ns ns ns ns
Note: *Delays based on 35 pF loading, except tENZL and tENZH. For tENZL and tENZH the loading is 5 pF.
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Pin Description
CLKA/B Clock A and B TDI, I/O Test Data Input
These pins are clock inputs for clock distribution networks. Input levels are compatible with standard TTL, LVTTL, 3.3 V PCI, or 5.0 V PCI specifications. The clock input is buffered prior to clocking the R-cells. If not used, this pin must be set LOW or HIGH on the board. It must not be left floating. (For RT54SX72S, these clocks can be configured as user I/O.)
GND Ground
Serial input for boundary scan testing and diagnostic probe. In flexible mode, TDI is active when the TMS pin is set LOW (refer to Table 1-2 on page 1-8). This pin functions as an I/O when the boundary scan state machine reaches the "logic reset" state.
TDO, I/O Test Data Output
LOW supply voltage.
HCLK Dedicated (Hardwired) Array Clock
Serial output for boundary scan testing. In flexible mode, TDO is active when the TMS pin is set LOW (refer to Table 1-2 on page 1-8). This pin functions as an I/O when the boundary scan state machine reaches the "logic reset" state.
TMS Test Mode Select
This pin is the clock input for sequential modules. Input levels are compatible with standard TTL, LVTTL, 3.3 V PCI or 5.0 V PCI specifications. This input is directly wired to each R-cell and offers clock speeds independent of the number of R-cells being driven. If not used, this pin must be set LOW or HIGH on the board. It must not be left floating.
I/O Input/Output
The I/O pin functions as an input, output, tristate, or bidirectional buffer. Based on certain configurations, input and output levels are compatible with standard TTL, LVTTL, 3.3 V PCI, or 5.0 V PCI specifications. Unused I/O pins are automatically tristated by the Designer software.
NC No Connection
The TMS pin controls the use of the IEEE 1149.1 boundary scan pins (TCK, TDI, TDO, TRST). In flexible mode, when the TMS pin is set LOW, the TCK, TDI, and TDO pins are boundary scan pins (refer to Table 1-2 on page 1-8). Once the boundary scan pins are in test mode, they will remain in that mode until the internal boundary scan state machine reaches the "logic reset" state. At this point, the boundary scan pins will be released and will function as regular I/O pins. The "logic reset" state is reached five TCK cycles after the TMS pin is set HIGH. In dedicated test mode, TMS functions as specified in the IEEE 1149.1 specifications.
TRST, I/O Boundary Scan Reset Pin
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be left floating with no effect on the operation of the device.
PRA, I/O, Probe A/B PRB, I/O
The Probe pin is used to output data from any userdefined design node within the device. This independent diagnostic pin can be used in conjunction with the other probe pin to allow real-time diagnostic output of any signal path within the device. The Probe pin can be used as a user-defined I/O when verification has been completed. The pin's probe capabilities can be permanently disabled to protect programmed design confidentiality.
TCK, I/O Test Clock (Input)
Once it is configured as the JTAG Reset pin, the TRST pin functions as an active-low input to asynchronously initialize or reset the boundary scan circuit. The TRST pin is equipped with an internal pull-up resistor. This pin functions as an I/O when the Reserve JTAG Reset Pin check box is cleared in Designer.
VCCI Supply Voltage
Supply voltage for I/Os. See Table 1-1 on page 1-8.
VCCA Supply Voltage
Supply voltage for Array. See Table 1-1 on page 1-8.
VCCR Supply Voltage
Supply voltage for input tolerance (required for internal biasing). See Table 1-1 on page 1-8.
Test clock input for diagnostic probe and device programming. In flexible mode, TCK becomes active when the TMS pin is set LOW (see Table 1-2 on page 1-8). This pin functions as an I/O when the JTAG state machine reaches the "logic reset" state.
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Package Pin Assignments
208-Pin CQFP
208 207 206 205 204 203 202 201 200
164 163 162 161 160 159 158 157
Pin #1 Index
1 2 3 4 5 6 7 8
156 155 154 153 152 151 150 149
208-Pin CQFP
44 45 46 47 48 49 50 51 52 113 112 111 110 109 108 107 106 105
53 54 55 56 57 58 59 60 61
97 98 99 100 101 102 103 104
Figure 2-1 * 208-Pin CQFP (Top View)
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208-Pin CQFP Pin A54SX16 Number Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Notes: 1. Pin 30 in RT54SX16 and RT54SX32-CQ208 is a TRST pin. 2. Pin 65 in A54SX32 and RT54SX32-CQ208 is a No Connect. GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCR GND VCCA GND I/O I/O I/O I/O I/O I/O I/O I/O RT54SX16 Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCR GND VCCA GND I/O TRST I/O I/O I/O I/O I/O I/O A54SX32 RT54SX32 Function Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCR GND VCCA GND I/O I/O I/O I/O I/O I/O I/O I/O GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCR GND VCCA GND I/O TRST I/O I/O I/O I/O I/O I/O Pin A54SX16 Number Function 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 I/O I/O I/O VCCI VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
208-Pin CQFP RT54SX16 Function I/O I/O I/O VCCI VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O A54SX32 RT54SX32 Function Function I/O I/O I/O VCCI VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O
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208-Pin CQFP Pin A54SX16 Number Function 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 Notes: I/O I/O I/O PRB, I/O GND VCCA GND VCCR I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O RT54SX16 Function I/O I/O I/O PRB, I/O GND VCCA GND VCCR I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O A54SX32 RT54SX32 Function Function I/O I/O I/O PRB, I/O GND VCCA GND VCCR I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O I/O I/O I/O PRB, I/O GND VCCA GND VCCR I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O Pin A54SX16 Number Function 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 I/O I/O I/O I/O I/O VCCA VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCA GND VCCR I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
208-Pin CQFP RT54SX16 Function I/O I/O I/O I/O I/O VCCA VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCA GND VCCR I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O A54SX32 RT54SX32 Function Function I/O I/O I/O I/O I/O VCCA VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCA GND VCCR I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCA GND VCCR I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
1. Pin 30 in RT54SX16 and RT54SX32-CQ208 is a TRST pin. 2. Pin 65 in A54SX32 and RT54SX32-CQ208 is a No Connect.
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SX Family FPGAs RadTolerant and HiRel
208-Pin CQFP Pin A54SX16 Number Function 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 Notes: VCCA GND I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA RT54SX16 Function VCCA GND I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA A54SX32 RT54SX32 Function Function VCCA GND I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA VCCA GND I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA Pin A54SX16 Number Function 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 CLKB VCCR GND VCCA GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O TCK, I/O
208-Pin CQFP RT54SX16 Function CLKB VCCR GND VCCA GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O TCK, I/O A54SX32 RT54SX32 Function Function CLKB VCCR GND VCCA GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O TCK, I/O CLKB VCCR GND VCCA GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI I/O I/O I/O I/O I/O I/O TCK, I/O
1. Pin 30 in RT54SX16 and RT54SX32-CQ208 is a TRST pin. 2. Pin 65 in A54SX32 and RT54SX32-CQ208 is a No Connect.
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256-Pin CQFP
256 255 254 253 252 251 250 249 248
200 199 198 197 196 195 194 193
Pin #1 Index
1 2 3 4 5 6 7 8
192 191 190 189 188 187 186 185
256-Pin CQFP
56 57 58 59 60 61 62 63 64 137 136 135 134 133 132 131 130 129
65 66 67 68 69 70 71 72 73
121 122 123 124 125 126 127 128
Figure 2-2 * 256-Pin CQFP (Top View)
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256-Pin CQFP Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 A54SX16 Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS NC NC I/O I/O NC I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O VCCI GND VCCA GND NC I/O I/O I/O NC I/O RT54SX16 Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS NC NC I/O I/O NC I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O VCCI GND VCCA GND NC I/O TRST I/O NC I/O A54SX32 Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI GND VCCA GND I/O I/O I/O I/O I/O I/O RT54SX32 Function GND TDI, I/O I/O I/O I/O I/O I/O I/O I/O I/O TMS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCI GND VCCA GND I/O I/O TRST I/O I/O I/O Pin Number 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 A54SX16 Function I/O I/O I/O NC I/O I/O I/O I/O VCCA I/O NC I/O I/O NC I/O I/O NC I/O I/O NC I/O GND I/O NC I/O NC I/O I/O I/O I/O NC I/O I/O I/O I/O NC I/O
256-Pin CQFP RT54SX16 Function I/O I/O I/O NC I/O I/O I/O I/O VCCA I/O NC I/O I/O NC I/O I/O NC I/O I/O NC I/O GND I/O NC I/O NC I/O I/O I/O I/O NC I/O I/O I/O I/O NC I/O A54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O RT54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O VCCA I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
Note: Pin 34 in RT54SX16 and RT54SX32-CQ256 is a TRST pin.
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256-Pin CQFP Pin Number 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 A54SX16 Function I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PRB, I/O GND VCCI GND VCCA I/O HCLK I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O GND I/O RT54SX16 Function I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PRB, I/O GND VCCI GND VCCA I/O HCLK I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O GND I/O A54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PRB, I/O GND VCCI GND VCCA I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O RT54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PRB, I/O GND VCCI GND VCCA I/O HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O Pin Number 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 A54SX16 Function I/O I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O NC TDO, I/O NC GND I/O I/O I/O I/O I/O I/O I/O I/O I/O NC NC NC VCCA I/O I/O I/O I/O I/O I/O I/O
256-Pin CQFP RT54SX16 Function I/O I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O NC TDO, I/O NC GND I/O I/O I/O I/O I/O I/O I/O I/O I/O NC NC NC VCCA I/O I/O I/O I/O I/O I/O I/O A54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA I/O I/O I/O I/O I/O I/O I/O RT54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TDO, I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA I/O I/O I/O I/O I/O I/O I/O
Note: Pin 34 in RT54SX16 and RT54SX32-CQ256 is a TRST pin.
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SX Family FPGAs RadTolerant and HiRel
256-Pin CQFP Pin Number 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 A54SX16 Function I/O I/O I/O I/O I/O I/O NC NC NC GND VCCR GND VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA GND GND I/O NC I/O I/O NC I/O I/O NC I/O RT54SX16 Function I/O I/O I/O I/O I/O I/O NC NC NC GND VCCR GND VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA GND GND I/O NC I/O I/O NC I/O I/O NC I/O A54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCR GND VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA GND GND I/O I/O I/O I/O I/O I/O I/O I/O I/O RT54SX32 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCCR GND VCCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCA GND GND I/O I/O I/O I/O I/O I/O I/O I/O I/O Pin Number 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 A54SX16 Function I/O NC I/O GND I/O NC NC I/O I/O NC I/O I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA CLKB VCCI GND
256-Pin CQFP RT54SX16 Function I/O NC I/O GND I/O NC NC I/O I/O NC I/O I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA CLKB VCCI GND A54SX32 Function I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA CLKB VCCI GND RT54SX32 Function I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O CLKA CLKB VCCI GND
Note: Pin 34 in RT54SX16 and RT54SX32-CQ256 is a TRST pin.
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v2.1
SX Family FPGAs RadTolerant and HiRel
256-Pin CQFP Pin Number 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 A54SX16 Function VCCR GND PRA, I/O I/O NC I/O I/O I/O I/O NC I/O I/O I/O NC I/O I/O NC GND I/O I/O NC I/O I/O I/O NC I/O I/O NC I/O I/O NC I/O I/O TCK, I/O RT54SX16 Function VCCR GND PRA, I/O I/O NC I/O I/O I/O I/O NC I/O I/O I/O NC I/O I/O NC GND I/O I/O NC I/O I/O I/O NC I/O I/O NC I/O I/O NC I/O I/O TCK, I/O A54SX32 Function VCCR GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TCK, I/O RT54SX32 Function VCCR GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TCK, I/O
Note: Pin 34 in RT54SX16 and RT54SX32-CQ256 is a TRST pin.
v2.1
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SX Family FPGAs RadTolerant and HiRel
Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version Changes in Current Version (v2 . 1) v2.0 The "Product Profile" was updated. The "Ordering Information" was updated. The "Product Plan" was updated. Table 1-1 was updated. Preliminary v1.5 i ii ii 8 Page
Power-up and -down sequencing information was modified: damage to the device is possible when 13 3.3 V is powered-up first and when 5.0 V is powered-down first. The last line of EQ 1-4 was cut off in the previous version. It has been replaced in the existing version. 16 8
Preliminary v1.5.2
The User I/Os changed.
The following sections are new or were updated: "Clock Resources", "Performance", "I/O Modules", 7 to "Power Requirements", "Boundary Scan Testing (BST)","Configuring Diagnostic Pins", "TRST Pin", 11 "Dedicated Test Mode", "Flexible Mode", "Development Tool Support", "RTSX Probe Circuit Control Pins", and "Design Considerations". The "Pin Description" has been updated. 28
Note that the "Package Characteristics and Mechanical Drawings" section has been eliminated from the N/A data sheet. The mechanical drawings are now contained in a separate document, Package Characteristics and Mechanical Drawings, available on the Actel web site.
v2.1
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SX Family FPGAs RadTolerant and HiRel
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet Supplement." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general product information. This brief gives an overview of specific device and family information.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the general family datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and for specifications that do not differ between the two families.
Export Administration Regulations (EAR)
The product described in this datasheet is subject to the Export Administration Regulations (EAR). They could require an approved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States.
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v2.1
Actel and the Actel logo are registered trademarks of Actel Corporation. All other trademarks are the property of their owners.
www.actel.com
Actel Corporation 2061 Stierlin Court Mountain View, CA 94043-4655 USA Phone 650.318.4200 Fax 650.318.4600
Actel Europe Ltd. Dunlop House, Riverside Way Camberley, Surrey GU15 3YL United Kingdom Phone +44 (0) 1276 401 450 Fax +44 (0) 1276 401 490
Actel Japan www.jp.actel.com EXOS Ebisu Bldg. 4F 1-24-14 Ebisu Shibuya-ku Tokyo 150 Japan Phone +81.03.3445.7671 Fax +81.03.3445.7668
Actel Hong Kong www.actel.com.cn Suite 2114, Two Pacific Place 88 Queensway, Admiralty Hong Kong Phone +852 2185 6460 Fax +852 2185 6488
5172141-8/3.05

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